MediaTek Unveils Affordable 7nm Dimensity 700 With 5G

Continuing its effort to make 5G more affordable, Taiwanese chipmaker MediaTek has unveiled the 7nm Dimensity 700, an SoC similar to the recently released Dimensity 720. It also comes with a 5G modem, but with improved connectivity and a handful of new features.

The Dimensity 700’s 5G modem has support for carrier aggregation that enables faster connections as well as seamless handover between 5G cells. The usual features such as Dual SIM and Dual Standby support are there but with VoNR (Voice over New Radio) that brings better audio quality compared to before.

Power saving has been improved as well thanks to MediaTek’s “5G UltraSave” power-saving technology.

The CPU configuration includes two Cortex A76 cores that are slightly faster than the Dimesnity 720 SoC, and six Cortex A55 cores. This chip has support for up to 12 GB of LPDDR4x RAM and UFS 2.2. The GPU included with the chip is the ARM Mali-G57 MC2.

Dimensity 700Dimensity 720
Process7 nm7 nm
CPU (big cores)2x Cortex-A76 at 2.2 GHz2x Cortex-A76 at 2.0 GHz
CPU (small cores)6x Cortex-A55 at 2.0 GHz6x Cortex-A55 at 2.0 GHz
GPUMali G57 MC2 (950 MHz)Mali G57 MC3
RAMUp to 12 GB, LPDDR4x 2,133 MHzUp to 12 GB, LPDDR4x 2,133 MHz
StorageUFS 2.2 (2-lane, up to 1 GB/s)UFS 2.2
Display1080p+, 90 Hz1080p+, 90 Hz
Modem5G, dual SIM, 2.77 Gbps5G, dual SIM, 2.77 Gbps
ConnectivityWi-Fi 5, Bluetooth 5.1Wi-Fi 5, Bluetooth 5.1
Camera64 MP stills, 1080p at 30 fps64 MP stills, 4K at 30 fps


As for displays, it can power up to 1080p panels with a 90Hz refresh rate. Camera capabilities go up to 1080 video recording and 64MP for photos. There is also support for multi-frame noise reduction and several AI enhancements. Speaking of AI enhancement, the chip can support multiple AI voice assistants from Google, Amazon, Tencent, etc.

There is currently no mention of what phones will feature the Dimesnity 700 first, but it will likely be revealed soon enough.

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