Realme’s X9 Pro Flagship Phone to Come With MediaTek Dimensity 1200

Tech and Telecom

Yesterday, the Taiwanese chipset maker MediaTek unveiled its latest 6 nm chipset the Dimensity 1200. Just a few hours after the launch event, Realme confirmed that its upcoming Realme X9 Pro Smartphone will be one of the first to leverage the power of the new chipset.

Dimensity 1200 is fabbed over the 6 nm process and is the chipset maker’s first chip built on this process. Moreover, this will also be the first 6 nm SoC Realme integrates into any of its phones.

The 7 nm SoC from MediaTek came with Cortex-A77 cores that topped out at 2.6GHz. However, the new Dimensity 1200 gets a Cortex-A78 prime core clocked at 3.0GHz. According to ARM’s official numbers, this means 20% higher single-core performance.

Realme X9 slim profile teased by company CEO

Realme India’s CEO Madhav Sheth has been teasing Realme X9 Pro for a while now. He has not revealed a lot of information about the handset but has been working on hyping up the audience.

According to previous leaks and rumors, the handset will pair the Dimensity 1200 SoC with 12 GB of LPDDR5 RAM and 128 GB or 256 GB storage. It will most likely launch with Realme UI 2.0 on top of Android 11. Camera-wise, it will most likely sport a 108 MP triple camera setup on the back. Apart from this, the X9 Pro will come with a 6.4-inch OLED display featuring a 120 Hz refresh rate, and 1080p resolution.

In other news, the company has also confirmed that it is working on a Snapdragon 888-powered phone so we’ll see another Realme flagship soon.

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