Samsung’s New LPDDR5X DRAM Paves Way for Thinner Smartphones

Samsung has unveiled a new LPDDR5X DRAM chip boasting the thinnest profile in its class. Available in 12 GB and 16 GB configurations, the 12nm chips are specifically designed for low-power applications, particularly smartphones with advanced on-device AI capabilities.

With a thickness of just 0.65 millimeters, the new chip is 9% slimmer than its predecessor. Samsung estimates that this reduction in thickness will lead to a 21.2% improvement in cooling efficiency.

Samsung achieved this breakthrough by refining its printed circuit board and epoxy molding compound processes, resulting in an LPDDR5X chip with a thickness comparable to a fingernail. The chip employs a four-layer stacked design, with each layer housing two LPDDR DRAMs.

Samsung has initiated mass production of the new, thinner chip and is supplying it to manufacturers. As the demand for high-performance, high-density mobile memory continues to rise, the company intends to expand its product line with six-layer 24 GB and eight-layer 32 GB modules, maintaining its leadership in ultra-thin package technology.

Now that Samsung has already started supplying its latest LPDDR5X DRAM breakthrough to its partners, it should not be long before we start seeing the technology in smartphones. Samsung’s next-in-line flagship series, the Galaxy S25 may also have these new memory chips.